RELIFE RL-403C Lead-Free Solder Balls 25000PCS for Mobile Phone Repair CPU Power IC Chip BGA Component Soldering Ball Tool

Product Features

These RELIFE RL-403C lead-free solder balls are 25000PCS in quantity, suitable for mobile phone repair and BGA component soldering.
They are lead-free and eco-friendly, with a melting point of 217-227°C, ensuring high-temperature resistance.
The size range is from 0.2-0.6mm, providing a wide choice for different applications.
They have a uniform size with a small tolerance (≤8um), ensuring strong solder joints.
They are suitable for IP models and high-current components like CPU and charging ports, providing reliable soldering results.

Specifications

Brand Name

RELIFE

Material

Metal

High-concerned chemical

None

DIY Supplies

Electrical

Type

Combination

Model Number

RELIFE

Brand

RELIFE

Product Name

Lead-free solder balls

Model

RL-403C

Specification

0.2,0.25,0.3,0.35,0.4,0.45,0.5,0.55,0.6,0.6mm

Quantity (Per Bottle)

25,000 pieces

Weight

6.7g/7.5g/8.8g/10g/12g/15g/17g/22g/27.5g/28.5g

Package Size

15*15*47mm

Melting point of solder balls

217-227°C

Function 1

Lead-free & eco-friendly

Function 2

Wide size range (0.2-0.65mm) for versatile use

Function 3

High temperature resistance (melting point ≥217℃)

Function 4

Uniform size & small tolerance (≤8um)

Function 5

Strong solder joints (high mechanical strength)

Function 6

Suitable for IP models & high-current components (CPU, charging ports)

Description

RELIFE RL-403C Lead-Free Solder Balls 25000PCS for Mobile Phone Repair CPU Power IC Chip BGA Component Soldering Ball Tool

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