Universal BGA Reballing Stencil 1/3Pcs square hole Direct heating BGA Template for Mobile phone laptop CPU IC Chip

Product Features

This high-quality universal BGA reballing stencil features square holes and direct heating, suitable for mobile phone, laptop CPU, and IC chips, with a thickness of 0.12MM/0.15MM.
It's a combination-type BGA template that serves as a great computer tool kit, perfect for various DIY electrical projects.
The BGA stencil comes in a bag package, originating from Mainland China, and is not customized, ensuring a standard and reliable product.
With no high-concerned chemicals, this stencil provides a safe and efficient solution for BGA reballing tasks.
Its universal design makes it adaptable to different models, offering flexibility and convenience for users in the electronics repair field.

Specifications

Brand Name

SAYTL

Model Number

Universal BGA Stencil

Size

thickness 0.12MM/0.15MM

Type

Combination

Application

Computer Tool Kit

High-concerned chemical

None

Package

Bag

DIY Supplies

Electrical

semi_Choice

yes

Description

3514 Sold

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