MECHANIC No-Clean Solder Wire 0.3/0.4/0.5/0.6/0.8mm Rosin Core Soldering Tin Wire for Phone Motherboard Welding Tools 2Pcs/lot

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US $17.42 ~ 17.68

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Product Features
  • This MECHANIC no-clean solder wire, with a diameter of 0.3/0.4/0.5/0.6/0.8mm and a melting point of about 300℃, is for phone motherboard welding.
  • As a soldering tin wire, it has low residue, smooth solder joints, and stable performance.
  • The rosin core of this solder wire, with 1-3% flux content, ensures effective soldering for phone motherboards.
  • Designed for phone motherboard welding, this solder wire offers strengthened tin and reliable performance.
  • This MECHANIC solder wire, with its various diameters and excellent soldering features, is a must-have for phone repair.
Specifications
Features
Strengthen the tin,Low residue
Features 1
Smooth solder joints,Stable performance
Application
MECHANIC DS6 Solder Wire
Brand Name
MECHANIC
Model Number
DS6 Solder Wire
Diameter
0.3/0.4/0.5/0.6/0.8mm
Melting Point
About 300℃
Flux Content
1-3%
Material
Tin
Weight
About 40g
semi_Choice
yes
637 Sold
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