Amaoe BGA reballing stencil For REDMI K20 K20Pro XIAOMI 9 Qualcomm Snapdragon 730 sm7150 855 SM8150 CPU Chip BGA Tin Plant Net bga reballing stencil

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US $20.06

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Product Features
  • Made of stainless steel, this BGA reballing stencil is suitable for REDMI K20, K20Pro, and XIAOMI 9. It has a thickness of 0.12MM.
  • Designed for commercial manufacture, it can be used for Qualcomm Snapdragon 730 and 855 CPU chips.
  • This stencil provides a precise tin-planting net for BGA reballing. It's a reliable tool for phone chip repairs.
  • With its accurate design, it helps in reballing BGA chips effectively. It's a great addition to electronic repair kits.
  • The BGA reballing stencil is from Mainland China, offering high-quality service for electronic device repairs.
Specifications
Hign-concerned Chemical
None
Type
Other
Model Number
Amaoe BGA Reballing Stencil
Material
Stainless Steel
Use
Commercial Manufacture
Thickness
0.12MM
semi_Choice
yes
32 Sold
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