Mobile Phone Repair Tools Wozniak Motherboard BGA IC Knife NAND Remove glue edge Thin blade Mobile maintenance tool + Hard straight blade magnetic pickup tool,mobile phone repair tools,cleaning squeegee,chainsaw carb repair kit,cutting tool,carb repair kit,filter mesh,surgical needle tool,sandpaper disc,tactical screws

Product Features

This set of mobile phone repair tools includes a motherboard BGA IC knife, NAND remove glue edge thin blade, and a hard straight blade magnetic pickup tool, ideal for various mobile phone repair tasks.
It can be used for multiple applications such as mobile phone disassembly, motherboard maintenance, and stripping, providing comprehensive solutions for mobile phone repair.
The tools are designed with precision, allowing for accurate and delicate operations during the repair process, ensuring high-quality repairs.
With these tools, you can perform carving and other tasks on mobile phone components, meeting different repair requirements.
They are essential for anyone involved in mobile phone repair, providing reliable and efficient performance for all your repair needs.

Specifications

Hign-concerned Chemical

None

Type

Hand Tool Parts

Model Number

009 008 007 w901

Application

repair tools

Application1

Mobile phone repair

Application2

stripping

Application3

carving

Application4

Motherboard maintenance

Application5

Mobile phone disassembly

semi_Choice

yes

Description

719 Sold

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