Thermal Pads Fehonda LTP81 18w/Mk Liquid Thermal Pad 12g VGA GPU IC Processor Rapid Cooling Thermal Putty For Heatsink Replace Pad thermal pad

Product Features

This Fehonda LTP81 18w/Mk liquid thermal pad with a weight of 12g is suitable for VGA, GPU, IC, and processors, providing rapid cooling.
Designed as a replacement thermal pad, it has a thermal conductivity of 18, a density of 3.85±0.2, and can tolerate-40~180℃.
Made of silicone, this thermal pad can fill thermal gaps and is ideal for heat sinks, CPUs, LEDs, and other components.
With its high thermal conductivity, this thermal pad can effectively transfer heat and improve the performance of electronic devices.
This liquid thermal pad is a great choice for those who need to cool their electronic components and ensure their stable operation.

Specifications

Brand Name

FEHONDA

Type

Replacement Thermal Pad

Hign-concerned Chemical

None

Model Number

LTP81

Thermal Conductivity

Weight

12g/50g/100g

Volume

Dimension

12g/50g/100g

Product name

Liquid Thermal Pad/Thermal Putty

Band

Fehonda

Number

LTP81

Thermal conductivity (W/M.K)

color

Gray

Size

12g 50g 100g

Main Raw Material

Silicone

Density(g/cm³)

3.85±0.2

Temperature tolerance range (℃)

-40~180℃

breakdown voltage(kv/mm)

>10

Usage

Heat sink, CPU, LED, GPU,IC

Feature

Thermal gap filling

Description

Thermal Pads Fehonda LTP81 18w/Mk Liquid Thermal Pad 12g VGA GPU IC Processor Rapid Cooling Thermal Putty For Heatsink Replace Pad thermal pad

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